| ▪ High Speed, Continuous Process |
| ▪ Non-Contact Glass Mask |
| ▪ 0.002" to 0.025" Thick Materials |
| ▪ Dry Film Type Photoresist |
▪ Automated vision alignment system
for
exposure assures
+/- 0.0005"
(0.0127mm) offset mismatch |
▪ Accurate unit-to-unit progression
tolerance of +/- 0.001" (0.025mm) |
| ▪ Leadframe, Connector, RF/EMI Products |
▪ Major benefit in prototyping designs
due to inexpensive tooling costs and
shorter lead times. |
Typical Material Thickness:
.005'' to .010" |
Advanced Material Thickness: .002'' to .004''
& .011'' to .023'' |
Top-to-Bottom
Mask Registration:
.0005'' Maximum |
Unit-to-Unit Progression Tolerance:
+/- .001'' |
Strip Pitch
Tolerance:
+/- .002'' |
Maximum Stair Step Tolerance:
.0015'' |
1/2 Etch Depth Tolerance:
30% to 60% of Material Thickness |
Min. Part
(Strand) Width:
.
500'' +/- .002'' |
Max. Part
(Strand) Width:
5.000 +/- .002'' |
